Bond Seam Inspection
Adhesives are increasingly being used as a joining technology for
automotive body panels including edge and non-edge joints. Total
accumulated length of glue lines can reach hundreds of meters per
automobile body. Similar to other automotive joining processes,
adhesive bonding may not provide 100% process reliability. Testing
is required to identify areas with lack of adhesive as well as
misaligned bond lines. Traditionally, this has been accompished only
through time-consuming and costly destructive testing.
Glue line and seam inspection for automotive body panels.
BHGE Inspection Technologies provides a non-destructive method
for conducting bond seam inspections. The Bond Seam Scanner is
easily clamped on body panels joined by a seam or other adhesive
bonding process. The design enables the array to adopt to contoured
parts commonly used in automobile designs. A spring-loaded encoder
wheel provides a stable inspection platform and tracks the sensor
position for bond lines up to 32 mm wide. A protection foil minimizes
the need for couplant and facilitates manual scanning.
The innovative Bond Seam Scanner linear array design ensures
inspection spatial resolution and detection resulting in an easily
interpreted visual image of the presence of adhesive allowing the
operator to evaluate the overall width of his bond seam and identify
where adhesive requirements are not met.
Custom array probes can be developed to inspect similar adhesive
applications in automotive and other industrial segments.
Pricing available upon request
Key Features & Equipment Used
• Bond Scanner App on the Mentor UT provides a guided workflow to
standardize and reduce time for calibration and set-up of inspection
• Touch screen operation for fast and easy interrogation of suspect areas
• Flexible 10 MHz array to contour to body panel curvature
• Spring loaded and sealed encoder for optimal positioning
• Protective foil for reduced wear and couplant
• Ergonomic handling and a smooth scanning operation
• Silicone oil free
• Mentor UT Phased Array Flaw Detector - P/N 100N3883
• Probe, LA10-32 flex (BondScanner) - P/N 0600325 (includes frame,
• Bond Scanner Foil - P/N 0600199
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